Key takeawayJingce Electronic's semiconductor orders on hand rose 98% year on year, becoming a core support for its performance, although progress from R&D and validation to volume delivery varies across new products.
How fast are semiconductor orders growing?
- Jingce Electronic has approximately RMB 3.609 billion in semiconductor orders on hand, up 98% from a year earlier and accounting for almost seventy percent of the company's total orders on hand. The semiconductor business has become a core support for its operating performance.
- The company's controlling shareholder has proposed using its own or self-raised funds to repurchase RMB 100 million to RMB 200 million in shares for purposes including equity incentives, employee stock ownership plans or a reduction in registered capital.
How far has advanced-process inspection progressed?
- A Soochow Securities research report dated 30 August said new orders for advanced processes below 28 nanometers accounted for more than seventy percent of the company's new semiconductor orders. Some of its flagship products, including film thickness, optical critical dimension measurement (OCD) and electron-beam products, have been delivered and accepted for 7-nanometer processes.
- Brightfield optical defect inspection equipment has passed acceptance on a 28-nanometer production line and been delivered for a 14-nanometer line, and has also secured a new 14-nanometer order from a leading domestic customer.
How are advanced packaging and back-end testing progressing toward delivery?
- Inspection equipment for patterned silicon wafers and unpatterned glass wafers has shipped in small batches, while 3D metrology for advanced processes is undergoing validation with leading domestic customers. Multiple units of equipment for glass substrates and panel-level advanced packaging have been delivered to date.
- In back-end testing, BI products supporting next-generation memory testing are in development and undergoing customer validation, while UFS 5.0 FT equipment is also being developed. Display driver chip test equipment has been delivered and accepted by customers, while general-purpose SoC test equipment remains in development.
- Among core components, 2D MEMS vertical probe cards have been delivered in volume, while high-frequency cantilever probe cards have been validated and put into volume use at leading domestic design companies.