Xinyichang’s semiconductor business accounts for over sixty percent of its order value; the company is essentially the exclusive supplier of glass-substrate equipment
The company said during an institutional investor meeting that domestic substitution of semiconductor die-bonding machines is accelerating and that the semiconductor business accounts for over sixty percent of its total order value; its glass-substrate products have been used by customers for 2 to 3 years.
Semiconductors have become the main source of Xinyichang’s orders. Domestic substitution of die-bonding machines and customer use of products in the glass-substrate field are two business developments disclosed by the company.
What share of new orders does the semiconductor business represent?
During an institutional investor conference call on 26 October, Xinyichang said its orders on hand were in good shape and that the semiconductor business accounted for more than sixty percent of its total order value. This proportion reflects the composition of orders and shows that semiconductors are already an important source of orders for the company.
The company also said domestic substitution in semiconductor die-bonding machines is accelerating. Die bonding is a critical step in packaging, and changes in demand for related equipment are directly relevant to an area of focus for the company.
How far has supply in the glass-substrate field progressed?
The company said it was among the earlier manufacturers to jointly validate and develop glass-substrate products with customers. It now supplies them on an essentially exclusive basis, and the products have been used by customers for 2 to 3 years.
Joint development and continued use show that the progress disclosed by the company has moved from validation to customer use. This statement refers to the glass-substrate field and not to the company’s supply position across its entire semiconductor equipment business.
Which stages does the company’s packaging equipment cover?
The company identifies semiconductor packaging as a core area of strength and strategic focus. Its products cover key stages including die bonding, wire bonding, testing and sorting, and are used across semiconductor products for applications including automotive electronics, communications and memory.
The company now develops and manufactures some core components in-house, including drivers, encoders, motion control cards and various high-precision motors. This means it supplies complete machines and also has the capability to independently develop and produce some key components.
