← Topics

Technology

Track semiconductors, computing infrastructure and the technology cycle.

Reports on this topic

Citi

Citi: Tencent showcases AI and payment services at APEC; Citi sees value in global exposure

Tencent has become a strategic partner of the 2026 APEC Leaders’ Meeting and will deploy media AI, real-time translation and cross-border payment services. Citi believes this will help raise awareness of the company’s technology brand and the Weixin ecosystem among overseas users; its HK$755 target price remains primarily supported by gaming, advertising and social businesses.

Goldman Sachs

Goldman Sachs: Kingsoft Cloud third-quarter preview: Easing compute constraints drives growth, while margins and valuation remain under pressure

Goldman Sachs expects Kingsoft Cloud’s third-quarter revenue to grow 34% and AI cloud revenue to grow 81%, driven mainly by demand from Xiaomi and Kingsoft and improved GPU supply. But a return to normal expense levels weighs on operating profit, expansion depends on customer prepayments and leasing support, and the target price has been cut to 15.5 dollars due to a higher discount rate.

J.P. Morgan

J.P. Morgan: Western Digital: Price increases drive an earnings beat, but why has expansion spending not shaken JPMorgan’s view?

Faster growth in the price per TB drove Western Digital’s first fiscal quarter revenue and margins above expectations, while its second-quarter guidance also exceeded consensus. JPMorgan raised its earnings forecasts and price target, citing a return to growth in shipped capacity and the focus of new investment on heads, platters and technology transitions.

Citi

Citi: Semiconductor equipment parts shortages widen: How much downside does Citi see for the big three?

After the equipment sector pulled back approximately 10% in a week, Citi turned its attention to supply constraints: AI demand remains strong, but parts shortages could limit shipments. Combining 2028 equipment spending scenarios with historical trough valuations, the bank estimates that the big three have approximately 10% and 30% of downside remaining under its base and bearish scenarios, respectively.

Deutsche Bank

Deutsche Bank: Micron’s technology roadmap: Staying with 6F², betting on hybrid bonding and AI memory expansion

Deutsche Bank reviews Micron’s technology symposium: The company has chosen to advance DRAM along the 6F² path, emphasizes the role of hybrid bonding in HBM bandwidth, and is extending its AI opportunity to low-power memory and SSDs. As the roadmap broadens, differences in customer demand and the timing of the NAND ramp in the second half of 2027 will determine the pace of product development.

Load more ↓