J.P. Morgan: Besi orders strengthen, but HBM hybrid bonding still faces a hurdle to mass production
Besi has received cumulative demand for more than 215 hybrid bonding tools from 23 customers. Adoption in logic-chip mass production is progressing faster, while HBM orders remain focused on research and development and pre-production preparations. JPMorgan maintains its Overweight rating and is watching the timing of technology adoption.